Elastic epoxy resin hardener system

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

C08G 59/20 (2006.01) C08G 59/10 (2006.01) C08G 59/12 (2006.01) C09J 5/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2138090

An elastically-cured epoxy resin composition is disclosed that contains compounds that contain at least two 1,2-epoxide groups. The epoxide group- containing compounds are reaction products of compounds (A1) that contain at least two 1,2-epoxide groups per molecule, polyoxyalkylenemonoamines (A2) that have a molecular weight (number average) greater than 900 g/mol, and optionally polycarboxy- lic acids (A3). The polyoxyalkylenemonoamines (A2) are polyoxypropylenemonoamines which preferably contain a mole fraction of up to 20% of oxyethylene units based on the total amount of oxypropylene and oxyethylene units. The resin composition addition- ally contains at least one hardener (B) and, if desired, customary additives (C).

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