H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12
H05K 3/32 (2006.01) H01L 27/01 (2006.01)
Patent
CA 1153128
A B S T R A C T Within a thin film circuit assembly a thin layer of aluminium is supported on a thin resistive layer of, say, a nickel-chromium alloy, and at least electrical interconnection members of the circuit assembly, between the aluminium layer and constituent electrical circuit elements of the assembly, are also of aluminium, for example, comprising aluminium wires, and are bonded directly to the thin highly conductive layer of aluminium, by employing ultrasonic or thermo-compression bonding techniques, obviating forming significant amounts of an undesirable intermetallic compound in these bonding regions, so that reliable bonds are obtained thereby.
375824
Evans Jonathan L.
Morrison John M.
Ferranti Limited
Fetherstonhaugh & Co.
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