H - Electricity – 01 – R
Patent
H - Electricity
01
R
H01R 4/58 (2006.01) H05K 3/20 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2326244
A metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.
Koguchi Mitsuo
Tai Tomishige
Japan Aviation Electronics Industry Limited
Kirby Eades Gale Baker
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