Electrical contact containing a braze diffusion barrier

Details Electrical contact containing a braze diffusion barrier Electrical contact containing a braze diffusion barrier

H - Electricity

01

H

H01H 1/00 (2006.01) B23K 35/00 (2006.01) H01H 1/02 (2006.01) H01H 11/04 (2006.01) B23K 35/30 (2006.01)

Patent

CA 2122525

A layer selected from a group comprising: molybdenum, tantalum, tungsten, osmium, rhenium, ruthenium and an alloy of two or more thereof on the under surface of an electrical contact acts as a barrier to copper diffusion from the braze material into the contact structure. A thin nickel layer on the barrier facilitates the brazing of the barrier coated contact surface to the copper electrodes.

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