Electrical device cooling system using a heat sink attached...

Details Electrical device cooling system using a heat sink attached... Electrical device cooling system using a heat sink attached...

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 23/373 (2006.01) H05K 7/20 (2006.01) H05K 1/00 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2098330

An electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat conduction channels passing through one layer to another where the heat generated by the semiconductor device is conducted into the conducting layers via the heat conduction channels and into a heat dissipation device, such as an aluminum heat sink.

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