Electrical interconnect structures

Details Electrical interconnect structures Electrical interconnect structures

H - Electricity

01

L

H01L 39/06 (2006.01) H01L 23/485 (2006.01) H01L 23/498 (2006.01) H01L 23/52 (2006.01) H01L 23/538 (2006.01) H01L 39/04 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2150913

Electrical interconnect structures comprised of high temperature superconducting signal layers on a substrate bonded to one another or optionally to a base substructure containing power and ground planes and processes for their preparation are disclosed.

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