Electrical interconnection for metallized ceramic arrays

Details Electrical interconnection for metallized ceramic arrays Electrical interconnection for metallized ceramic arrays

H - Electricity

05

K

356/5

H05K 3/12 (2006.01) H01B 5/14 (2006.01)

Patent

CA 1038501

ELECTRICAL INTERCONNECTION FOR METALLIZED CERAMIC ARRAYS Abstract of the Disclosure Metal such as gold used for electroplating small metallized ceramic pieces is conserved by providing arrays of such pieces in which electrical interconnections crossing lines of separation of the pieces completely connect all parts to be plated in the array but are severed when the peices are separated.

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