Electrical make/break interconnect having high trace density

Details Electrical make/break interconnect having high trace density Electrical make/break interconnect having high trace density

B - Operations, Transporting

41

J

339/92

B41J 2/135 (2006.01)

Patent

CA 2008181

ELECTRICAL MAKE/BREAK INTERCONNECT HAVING HIGH TRACE DENSITY ABSTRACT OF THE DISCLOSURE A pressure make/break interconnect for two sets of coplanar! parallel traces (30 and 46) includes contact pads (50 and 52) on the ends of the one or both sets of traces (30 and 46), the pads (50 and 52) being wider than the spaces between the traces (30 and 46) but staggered so that there is room for the pads (50 and 52) to fit between the traces (30 and 46). One of each facing pair of the traces (30 and 46) or pads (50 and 52) has on its facing surface a bump (66), which serves as the actual contact point and aids in increasing the contacting pressure. An interconnect support (70) behind one of the pads (50 or 52) is configured to aid in intensifying the pressure applied through the bump (66), ensuring good contact. The interconnect support (70) is preferably made of an elastomer and has ridges (74 and 76) on both sides underlying the contact pads (50 and 52), with protrusions (80) on the ridges (74) facing the pads (50 and 52), that extend upwardly to support the contact pads (50 and 52) while the connection is made.

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