Electrical slip ring having a higher circuit density

Details Electrical slip ring having a higher circuit density Electrical slip ring having a higher circuit density

H - Electricity

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H01R 39/08 (2006.01) H01R 39/10 (2006.01) H01R 43/10 (2006.01) H05K 1/00 (2006.01) H05K 3/10 (2006.01) H05K 3/40 (2006.01) H05K 1/11 (2006.01)

Patent

CA 2296825

Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.

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