Electrical splice sealant pad

H - Electricity – 02 – G

Patent

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Details

H02G 15/04 (2006.01) H01R 13/52 (2006.01) H02G 15/18 (2006.01)

Patent

CA 2091672

2091672 9207397 PCTABS00012 An improved sealant pad comprises a rectangular field of viscous sealant supported by a tough flexible film substrate. The substrate and sealant field may have the same dimensions of length and width but generally the substrate will extend beyond the sealant field on at least two opposing sides. One or more of these extending borders of substrate may be advantageously coated with adhesive thereby providing sealant pads with up to four extending flaps of adhesive coated substrate surrounding the sealant field. The sealant pads may be produced in a variety of configurations and are useful for environmentally sealing electrical connections such as are found in wiring harnesses.

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