Electrically and thermally conductive adhesive transfer tape

H - Electricity – 01 – L

Patent

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Details

356/193, 117/8

H01L 23/48 (2006.01) H01L 21/302 (2006.01) H01L 23/373 (2006.01) H01L 23/482 (2006.01) H05K 3/32 (2006.01)

Patent

CA 1247943

-1- Abstract of the Disclosure The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

454563

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