Electrically conductive connection between a chip and a...

H - Electricity – 01 – L

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H01L 21/60 (2006.01) C09J 9/02 (2006.01) C09J 11/04 (2006.01) D21H 21/48 (2006.01) G06K 19/077 (2006.01) H01L 23/48 (2006.01) H01L 23/58 (2006.01)

Patent

CA 2432701

A document of value has a chip and is connected to a coupling element for the transmission of data and/or energy from and/or to the chip via an adhesive. According to a first embodiment, the adhesive contains electrically conductive particles which are smaller than the distance between the contact surfaces 5 of the chip 3 and the coupling element 2. According to a second embodiment, the conductive adhesive contains electrically conductive particles which are soft at an elevated temperature at which the chip 3 is applied to the coupling element 2. According to a third embodiment, it is possible to dispense with the electrically conductive particles in the adhesive. Instead, the transmission of data/energy is carried out via an alternating field coupled in capacitively at high frequencies of about 2 GHz.

Selon l'invention, un document de valeur comporte une puce et est relié au moyen d'un adhésif à un élément de couplage pour la transmission de données et/ou d'énergie de et/ou vers la puce. Dans un premier mode de réalisation, ledit adhésif contient des particules électroconductrices plus petites que l'écart entre les surfaces de contact (5) de la puce (3) vers l'élément de couplage (2). Dans un deuxième mode de réalisation, l'adhésif conducteur contient des particules électroconductrices se présentant sous forme molle à une température élevée à laquelle la puce (3) est appliquée sur l'élément de couplage (2). Dans un troisième mode de réalisation, l'adhésif ne contient pas de particules électroconductrices, la transmission de données/énergie étant effectuée par l'intermédiaire d'un champ alternatif couplé de manière capacitive avec des fréquences élevées d'environ 2 GHz.

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