Electrically conductive paste materials and applications

Details Electrically conductive paste materials and applications Electrically conductive paste materials and applications

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 1/00 (2006.01) H01B 5/00 (2006.01) H01L 21/60 (2006.01) H01L 23/498 (2006.01) H05K 3/32 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2159234

A structure and method of fabrication are described. The structure is a combination of a polymeric material and particles, e.g. Cu, having an electrically conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The structure is disposed between two electrically conductive surfaces, e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

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