Electrically conductive pressure-sensitive adhesive tape

H - Electricity – 01 – B

Patent

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26/131, 337/56

H01B 1/00 (2006.01) C09J 7/02 (2006.01) C09J 9/02 (2006.01) H01B 1/22 (2006.01) H01R 4/04 (2006.01) H05K 3/32 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1317002

Abstract Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 µm thick.

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