H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 9/00 (2006.01) B29C 45/00 (2006.01) B29C 70/88 (2006.01) B32B 5/00 (2006.01) B32B 7/02 (2006.01) B32B 27/18 (2006.01)
Patent
CA 2080177
An enclosure for an electronic device forms a barrier to electro-magnetic radiation. A typical cross-section of the enclosure comprises three parallel layers. The outer and inner surface layers are of a polymeric base material in which is suspended an electrically conductive fill material, giving the surface layers relatively high electrical conductivity. The middle layer is of a polymeric base material, in which is suspended fill material having high magnetic permeability, giving the middle layer relatively high magnetic permeability. In the preferred embodiment, the enclosure is constructed using a co-injection molding process. Nickel-coated graphite (high conductivity) in a polymeric base is injected into a mold from the outer co-injection nozzle, while carbonyl iron powder (high permeability) in a polymeric base is injected into the mold from the inner co-injection nozzle. The resultant molded structure contains the three layers described above, yet can be made inexpensively in a single co-injection molding operation. The enclosure may comprise multiple co-injection molded pieces, which are attached together by any of various conventional means.
Highum Edward Allan
Mueller Alfred Wilhelm
Nash Thomas William
Stadler Ewald Emil Gottlob
Thorvilson Scott Marvin
Barrett B.p.
International Business Machines Corporation
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