Electro-optical multiple connection arrangement

Details Electro-optical multiple connection arrangement Electro-optical multiple connection arrangement

G - Physics

02

B

345/62

G02B 6/42 (2006.01) G02B 6/12 (2006.01) G02B 6/38 (2006.01) G02B 6/43 (2006.01) H01L 27/14 (2006.01)

Patent

CA 2013455

Abstract Electro-Optical Multiple connection Arrangement For the connection of an electro-optical chip (5) to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible interconnect member (2) and connected, using a film bonding process previously known only for purely electrical connections, both with connector elements of the chip and with connector paths or optical waveguides (3) on the substrate. If the optical connecting elements (1) are positioned physically between the electrical connecting elements (8), they are secured and located by the soldering connections produced on both sides of the electrical connecting elements. In addition to electrical test adapter connectors, [temporary] optical test loops which link optical inputs and outputs with each other and which are removed during a later stamping process can also be provided on the flexible interconnect member (2).

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