Electro-plating apparatus and method

Details Electro-plating apparatus and method Electro-plating apparatus and method

C - Chemistry, Metallurgy

25

D

C25D 5/08 (2006.01) C25D 5/02 (2006.01) C25D 7/12 (2006.01) C25D 17/00 (2006.01)

Patent

CA 2403122

A single delivery channel is formed by, and between, inner wall (2) and baffle (3). Electrolyte (5) is pumped up the interior of channel (1) and is directed onto substrate (4) being a cathode maintained at -10 volts. The upper part of the inner wall (2) of channel (1) forms the anode such that electrolyte is forced between the substrate and the upper horizontal surface of the anode (6). A second baffle (7) is provided in order to assist in collecting and removing electrolyte (5) after impingement with substrate (4), possible for re- use. Contact between the electrolyte (5) and substrate (4) is optimised by providing the electrolyte with a swirling motion as it passes up channel (1). Anode (6) is a solid conducting bar (10), alternatively it is formed of solid rods (11) or tubes (12).

Un seul canal de distribution est formé par une paroi interne (2) et un écran (3), et entre ceux-ci. L'électrolyte (5) est pompé à l'intérieur du canal (1) et est dirigé sur un substrat (4) qui est une cathode maintenue à -10 volts. La partie supérieure de la paroi interne (2) du canal (1) constitue l'anode, de telle manière que l'électrolyte est poussé entre le substrat et la surface horizontale de l'anode (6). Un second écran (7) est fourni en vue d'aider à recueillir et à éliminer l'électrolyte (5) après impact avec le substrat (4), en vue d'une éventuelle réutilisation. Un contact entre l'électrolyte (5) et le substrat (4) est optimisé par le biais d'un mouvement tournoyant de l'électrolyte tandis que celui-ci remonte le canal (1). L'anode (6) est une barre conductrice solide (10), constituée en alternance de tiges solides (11) ou de tubes (12).

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