Electrochemical deposition of tantalum and/or copper in...

Details Electrochemical deposition of tantalum and/or copper in... Electrochemical deposition of tantalum and/or copper in...

C - Chemistry, Metallurgy

25

D

C25D 3/54 (2006.01) C25D 3/38 (2006.01)

Patent

CA 2590080

The invention relates to a method for electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid, containing at least one tetraalkylammonium-, tetraalkylphosphonium-, 1,1-dialkylpyrrolidinium-, 1- hydroxyalkyl-1-alkylpyrrolidinium-, 1-hydroxyalkyl-3-alkylimidazolium- or bis(1-hydroxyalkyl)imidazolium cation, whereby the alkyl groups or the alkylene chains of the 1-hydroxyalkyl groups can independently have 1 to 10 C atoms.

L'invention concerne un procédé de dépôt électrochimique de tantale et/ou de cuivre sur un substrat dans un liquide ionique contenant au moins un cation tétraalkylammonium, tétraalkylphosphonium, 1,1-dialkylpyrrolidinium, 1-hydroxyalkyl-1-alkylpyrrolidinium, 1-hydroxyalkyl-3-alkylimidazolium ou bis(1-hydroxyalkyl)imidazolium, les groupes alkyle ou la chaîne alkylène dans le groupe 1-hydroxyalkyle pouvant présenter chacun indépendamment 1 à 10 atomes de carbone.

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