Electrochemical treatment of copper for improving its bond...

Details Electrochemical treatment of copper for improving its bond... Electrochemical treatment of copper for improving its bond...

C - Chemistry, Metallurgy

25

D

204/10

C25D 5/18 (2006.01) C25D 5/16 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1212071

ABSTRACT OF THE DISCLOSURE A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.

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