H - Electricity – 01 – M
Patent
H - Electricity
01
M
319/22, 154/107.
H01M 4/88 (2006.01) C04B 37/00 (2006.01) H01M 4/96 (2006.01) H01M 8/02 (2006.01)
Patent
CA 1337632
An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 102 to 106 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 µm and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas unpermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA., at the bonded surface in the thickness direction thereof.
591883
Fukui Hiroaki
Miwa Kishio
Noma Fumiaki
Smart & Biggar
Toray Industries Inc.
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