Electrode diffusion bonding

Details Electrode diffusion bonding Electrode diffusion bonding

H - Electricity

05

H

H05H 1/34 (2006.01) B23K 20/00 (2006.01) B23K 20/02 (2006.01) B23K 37/00 (2006.01) H05B 7/00 (2006.01)

Patent

CA 2357808

An electrode for a plasma arc torch and method of fabricating the same are disclosed, and wherein the electrode comprises a copper holder defining a cavity in a forward end. An emissive element and separator assembly is positioned in the cavity, and no brazing materials are used to secure the components of the electrode. The emissive element, separator, and metallic holder are heated to accelerate diffusion bonding between the emissive element and separator, and between the separator and metallic holder. A crimping process is also disclosed for further strengthening the electrode and increasing the operational life span thereof.

Affiliated with

Also associated with

Rating

Electrode diffusion bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrode diffusion bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrode diffusion bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1764534