Electrodeposition coating process of photoresist for printed...

Details Electrodeposition coating process of photoresist for printed... Electrodeposition coating process of photoresist for printed...

G - Physics

03

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204/97.02

G03F 7/16 (2006.01) G03F 7/09 (2006.01) G03F 7/095 (2006.01) G03F 7/11 (2006.01) H05K 3/00 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1337864

An electrodeposition coating process of a photoresist for printed circuit board which comprises electrodeposition coating on a conductive surface a photosensitive electrodeposition coatinq composition (A), and thereafter further electrodeposition coating on the resultant coated plate an electrodeposition coating composition (B) composed chiefly of water-soluble or water-dispersible resin having a glass transition temperature (Tg) not lower than 20°C.

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