C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/44 (2006.01) C25D 3/42 (2006.01) C25D 3/54 (2006.01) C25D 17/00 (2006.01)
Patent
CA 2517977
An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous or non-aromatic organic solvent. Electrodeposition of a metal from the electroplating solution includes preparing an electroplating solution and electrodepositing the metal from the electroplating solution onto a conductive substrate under a cathodic current. An electroplating system has a plating chamber containing an electroplating solution, an entry point to the electroplating system, and a transporting system to convey a part to be electroplated from the entry point to the plating chamber. The electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives, the mixture dissolved in the non-aqueous non-aromatic organic solvent.
L'invention concerne une solution d'électrodéposition comprenant un solvant organique non aromatique non aqueux et un mélange qui renferme des sels métalliques solubles et des additifs organiques dissous dans le solvant. L'électrodéposition de métal depuis la solution d'électrodéposition consiste à préparer une telle solution et à réaliser l'opération sur un substrat conducteur sous courant cathodique. On utilise un système d'électrodéposition ayant une plaque de galvanoplastie, un point d'entrée au système, et un système de transport d'une pièce à traiter, depuis le point d'entrée vers la chambre. La solution d'électrodéposition comprend un solvant organique non aromatique non aqueux et un mélange qui renferme des sels métalliques solubles et des additifs organiques dissous dans le solvant.
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Global Ionix Inc.
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