Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

C - Chemistry, Metallurgy

25

D

204/36

C25D 3/38 (2006.01)

Patent

CA 1050924

ABSTRACT OF THE DISCLOSURE A composition and method for electrodepositing ductile, bright, well leveled copper deposits from an aqueous acidic copper plating bath having dissolved therein from about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as the reaction product of a polyalkanol- amine with an alkylating or quaternization agent. The polyalkan- olamine constituent typically is formed as the reaction product of a polyalkylenimine (e.g. polyethylenimine) with an alkylene oxide.

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