Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

C - Chemistry, Metallurgy

25

D

204/36, 260/593,

C25D 3/38 (2006.01) C07C 93/04 (1980.01) C07C 141/02 (1980.01)

Patent

CA 1105045

ABSTRACT OF THE DISCLOSURE A composition and method for electrodepositing ductile, bright, well leveled copper deposits from an aqueous acidic copper plating bath having dissolved therein from about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as the reaction product of a polyalkanolamine with an alkylating or quaternization agent. The polyalkanolamine constituent typically is formed as the reaction product of a polyalkylenimine (e.g. polyethylenimine with an alkylene oxide.

300851

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