Electrodeposition of gold

Details Electrodeposition of gold Electrodeposition of gold

C - Chemistry, Metallurgy

25

D

204/25

C25D 3/62 (2006.01) C25D 3/48 (2006.01) C25D 5/10 (2006.01)

Patent

CA 1053603

ELECTRODEPOSITION OF GOLD ABSTRACT OF DISCLOSURE The method of preventing or inhibiting diffusion of a base metal into an electrodeposited gold layer on said base metal which comprises electrodepositing a barrier layer on the base metal comprising a tungsten-cobalt alloy or a tungsten- nickel alloy and subsequently electrodepositing gold on the alloy barrier layer. The invention also includes the use of chelating agents in tungsten-cobalt and tungsten-nickel plating baths.

249748

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