C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/31
C25D 3/12 (2006.01) C25D 3/14 (2006.01)
Patent
CA 1041456
Abstract of the Disclosure Sulfur-free hard nickel in thicknesses in excess of about 50 microns is electrodeposited from nickel plating baths containing 1 to about 8 grams per liter (gpl) of aromatic amide.
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