Electrodeposition of noble metal alloys

Details Electrodeposition of noble metal alloys Electrodeposition of noble metal alloys

C - Chemistry, Metallurgy

25

D

204/26

C25D 3/56 (2006.01) C25D 3/02 (2006.01)

Patent

CA 1066651

ABSTRACT OF THE DISCLOSURE A cyanide ion-free bath for the electrodeposition of a noble metal alloy, e.g. gold, silver or palladium, contains the noble metal in the form of a thiosulphato-complex such as sodium dithiosulphato-argentate or -aurate, or sodium hepta- thiosulphato-diaurate, and possibly at least one additional metal selected from the group consisting of copper, nickel, cobalt, manganese, zinc, cadmium, indium, tin, lead, antimony and arsenic for alloying with the noble metal. The bath may also contain a reducing agent, e.g., an alkali metal nitrate, oxalate or sulphite and a buffer such as disodium phosphate, an alkali metal carbonate, borate, acetate, citrate or metabisulphite, or boric acid and ethylene glycol.

235969

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