C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/29.5
C25D 3/52 (2006.01) C25D 7/00 (2006.01)
Patent
CA 2023871
A process is described for electroplating palladium and palladium alloys from an aqueous bath. Particularly important is the use of certain organic additives that improves appearance, insures ductile and crack-free deposits even for relatively thick deposits and permits relatively high electroplating rates. Also described are a variety of articles with electroplated palladium made in accordance with the invention.
Abys Joseph Anthony
Chinchankar Vijay
Eckert Virginia Toohey
Kadija Igor Veljko
Kudrak Edward John Jr.
American Telephone And Telegraph Company
Kirby Eades Gale Baker
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