C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/44 (2006.01)
Patent
CA 2415772
This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activativing a catalytically inactive substrate.
L'invention concerne le dépôt autocatalytique de platine sur un substrat, un bain de dépôt de platine aqueux, un procédé de dépôt d'une couche uniforme de platine sur divers substrats au moyen d'une composition de dépôt autocatalytique, ainsi qu'un article recouvert de platine ainsi obtenu. Le bain de dépôt permet un dépôt autocatalytique direct de platine sur des substrats catalytiquement actifs et inactifs, conducteurs et non conducteurs, évitant ainsi les coûts supplémentaires liés à l'activation d'un substrat catalytiquement inactif.
Kozlov Alexander S.
Narasimhan Dave
Palanisamy Thirumalai
Gowling Lafleur Henderson Llp
Honeywell International Inc.
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