Electroless copper deposition process having faster plating...

Details Electroless copper deposition process having faster plating... Electroless copper deposition process having faster plating...

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/40 (2006.01)

Patent

CA 1135903

ABSTRACT OF THE DISCLOSURE There is provided a method for increasing the useful effective plating rate of an electroless copper deposition solution which comprises copper ion, a complexing agent for copper ion, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function of a pH above 10. In accordance with this invention, the plating rate of such a solution may be significantly increased by operation thereof in, the presence of an accelerating or depolar- izing agent at a pH to achieve a plating rate above the plating rate of the solution without such an agent at the same pH. The accelerating or depolarizing agents for use herein include compounds containing a delocalized pi-bond, such as heterocyclic aromatic nitrogen and sulfur compounds, non-aromatic nitrogen compounds having at least one delocalized pi-bond, and aromatic amines.

331706

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