Electroless copper deposition solution using a hypophosphite...

Details Electroless copper deposition solution using a hypophosphite... Electroless copper deposition solution using a hypophosphite...

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/40 (2006.01)

Patent

CA 1130952

ABSTRACT Electroless copper deposition solutions, and method of electrolessly depositing copper onto a suitably catalysed and generally non-conductive workpiece surface using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with solution. The reduc- ing agent is a soluble source of hypophosphite ions and the complexing agent is selected to be effective at pH level between 5 and 13 for complexing cupric ions and the solution pH is co- ordinated within the pH range for the complexer selected to give a deposited conductive copper film.

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