Electroless copper plating

Details Electroless copper plating Electroless copper plating

H - Electricity

05

K

117/80

H05K 3/12 (2006.01) C23C 18/40 (2006.01)

Patent

CA 1036876

ELECTROLESS COPPER PLATING Abstract of the Disclosure By means of constant control of the temperature between 70° and 80°C. and control of the cyanide ion concentration between 0.0002 and 0.0004 molar, high quality electroless copper plating processes are carried out from solutions containing cupric ions.

214898

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