Electroless copper plating

Details Electroless copper plating Electroless copper plating

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/38 (2006.01) C23C 18/40 (2006.01) C23C 18/54 (2006.01)

Patent

CA 1201253

ABSTRACT OF THE DISCLOSURE In an aqueous electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, sufficient complexing agent to render said cupric ions soluble in alkaline solution, and the add- ition product of formaldehyde and a formaldehyde add- ition agent, the improvement comprising a solution pH of at least 11 and a molar ratio of each of copper and free formaldehyde to hydroxide whereby the concentration of free formaldehyde in solution during plating detect- able by analysis is essentially 0.

440810

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