Electroless copper plating

Details Electroless copper plating Electroless copper plating

C - Chemistry, Metallurgy

23

C

117/80

C23C 18/40 (2006.01) C23C 18/16 (2006.01)

Patent

CA 1093911

For: ELECTROLESS COPPER PLATING Abstract of the Disclosure.- Maintaining copper ion concentration and controlling the increasing concentration of salt-forming anions in electroless copper plating of articles by contacting all or a portion of the copper deposition solution after interruption of plating in an enriching operation to replenish its depleted copper content by using a selected copper-containing substance (e.g., cupric oxide or basic copper sulfate) having either a small or no content of salt-forming anions to minimize the undesirable build-up of salts, and resuming plating with the enriched solution or portion thereof.

272215

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