C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
117/77, 32/78, 1
C23C 18/38 (2006.01) C23C 18/16 (2006.01) C23C 18/30 (2006.01) H05K 3/00 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2029090
An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.
Procédé de dépôt autocatalytique d'un revêtement métallique, utilisé surtout lors de la métallisation des trous traversant les substrats des circuits imprimés, et plus particulièrement, pour déposer par addition du cuivre métallique sur les surfaces des trous traversants, dans lequel le substrat est soumis, au moins de manière intermittente, à un mouvement de vibration pendant son contact avec le bain de dépôt autocatalytique, et appareil de dépôt autocatalytique d'un revêtement métallique utilisé pour le procédé.
Donlon Edward T.
Kukanskis Peter E.
Macdermid Incorporated
Perley-Robertson Hill & Mcdougall Llp
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