Electroless copper plating solutions

Details Electroless copper plating solutions Electroless copper plating solutions

C - Chemistry, Metallurgy

23

C

6/4

C23C 18/40 (2006.01)

Patent

CA 1083303

ABSTRACT: Electroless copper plating bath con- taining a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formalde- hyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained. -17-

270026

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