Electroless deposition of copper

Details Electroless deposition of copper Electroless deposition of copper

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/52 (2006.01)

Patent

CA 1144304

Abstract of the Disclosure Transition metals form a plated deposit in an electroless transition metal plating bath containg an organophosphorus complexing agent selected from the class of compounds having the general formulas: Image wherein R1 is alkyl having from 1 to 5 carbon stoms, alkali metal and ammonium salts of said compounds, and Image wherein R2 is Image R1 is selected from the class consisting of R2 and -CH2CH2OH, and R4 is selected from the group consisting of R2, CH2CH2OH, and Image wherein each M is independently selected from the group consisting of H, NH, and alkali metal, and "n" is an integer from 1 to 6 inclusive. These baths have unique properties, including the ability to be formulated to have selected operating pH values within a wide pH range and the ability to operate effectively at the selected pH value.

337719

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