Electroless direct deposition of gold on metallized ceramics

Details Electroless direct deposition of gold on metallized ceramics Electroless direct deposition of gold on metallized ceramics

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/42 (2006.01) H05K 1/03 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1205604

ABSTRACT OF THE DISCLOSURE Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tunsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.

441806

Affiliated with

Also associated with

Rating

Electroless direct deposition of gold on metallized ceramics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless direct deposition of gold on metallized ceramics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless direct deposition of gold on metallized ceramics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1188618