Electroless gold plating

Details Electroless gold plating Electroless gold plating

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/44 (2006.01)

Patent

CA 1188458

ABSTRACT OF THE DISCLOSURE Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is an admixture of (a) a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate: and (b) a water-soluble monovalent gold component such as an alkali metal aurocyanide. The bath contains an amino borane, alkali metal borohydride, alkali metal cyanoborohydride, hydrazine, or hyposulfite as the reducing agents; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrate is also described and claimed.

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