Electroless gold plating process

Details Electroless gold plating process Electroless gold plating process

C - Chemistry, Metallurgy

23

C

6/4, 117/77

C23C 18/44 (2006.01) C23C 18/40 (2006.01)

Patent

CA 1038559

ABSTRACT OF THE DISCLOSURE An electroless plating bath, and processes for the autocatalytic deposition of Group 1B metals upon various substrates using such a bath, are disclosed. The electroless plating bath disclosed includes an aqueous solution of an imide complex of the Group 1B metal to be plated, an alkali metal cyanide, and a reducing agent, and is maintained at a pH of from about 11 to 14 by the addition of alkali metal hydroxides. In a preferred embodiment, an electroless gold plating bath is disclosed, including an aqueous solution of an alkali metal gold imide complex. Methods for plating various substrate from such electroless plating baths are also surfaces are rendered catalytically active prior to immersion in plated, they are preferably pre-coated with a thin plate by immersion in an aqueous plating bath including a soluble gold salt, an ammonium buffering agent, and an organic chelating agent, prior to immersion in the electroless plating baths of the present invention.

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