Electroless nickel plating

Details Electroless nickel plating Electroless nickel plating

C - Chemistry, Metallurgy

08

K

6/5, 117/78

C08K 3/08 (2006.01) C23C 18/32 (2006.01) C23C 18/34 (2006.01) C23C 18/54 (2006.01)

Patent

CA 1197058

ABSTRACT OF THE DISCLOSURE An electroless nickel plating composition characterized by the addition of a polymer formed from a 2-acrylamido or 2-methacrylamido alkyl sulfonic acid monomer. The polymer additive increases the rate of deposition from solution, and to a minor extent, improves the appearance of a nickel deposited from the solution.

444093

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