Electroless plating bath monitor

C - Chemistry – Metallurgy – 23 – C

Patent

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32/8, 117/80

C23C 18/38 (2006.01) C23C 18/16 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1225549

ELECTROLESS PLATING BATH MONITOR Abstract of the Disclosure Method and apparatus for determining the deposition capability of an electroless metal plating bath by monitoring the difference in instantaneous electrical potential between a pair of test coupons immersed in the bath in which one coupon is seeded to initiate plating thereon of the bath metal and the other coupon has a surface of the bath metal. The magnitude of the difference in potential and its change with respect to time during concurrent immersion of both coupons indicate the probable rate and quality of the bath deposition onto work pieces. EN983035

506444

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