Electroless plating of nickel onto surfaces such as copper...

Details Electroless plating of nickel onto surfaces such as copper... Electroless plating of nickel onto surfaces such as copper...

C - Chemistry, Metallurgy

23

C

6/5, 117/78

C23C 18/32 (2006.01) C23C 18/18 (2006.01) C23C 18/30 (2006.01) H05K 3/10 (2006.01) H05K 3/24 (2006.01) H05K 1/09 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2031549

Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.

Les surfaces conductrices comme les surfaces en cuivre ou en tungstène, particulièrement les zones des circuits en cuivre des substrats de plaques de circuit imprimé ou les zones fondues des circuits en tungstène des ensembles fondus en tungstène-céramique sont activées en vue de la réception de dépôt de nickel autocatalytique en les recouvrant de particules de zinc métallique, surtout par contact des surfaces avec une suspension aqueuse de particules de zinc métallique.

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