Electroless plating of nonconductive substrates

Details Electroless plating of nonconductive substrates Electroless plating of nonconductive substrates

B - Operations, Transporting

01

J

6/2, 252/53.B

B01J 27/06 (2006.01) B01J 27/08 (2006.01) C23C 18/28 (2006.01)

Patent

CA 1069488

ABSTRACT An electroless plating catalyst prepared by reacting a tin salt in the molten state with a precious metal compound without HC1 or added H2O. The final catalyst may be a solid or a liquid at room temperature, depending on the reaction conditions, and it can be reconstructed by dilution with an appropriate aqueous solution to prepare or replenish catalytic working baths for electroless plating. Examples include the molten salt reaction of a noble metal salt with molten stannous chloride, stannous chloride dihydrate, or mixtures with other compatible materials containing either or both.

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