Electroless plating of peroxide forming metals

C - Chemistry – Metallurgy – 23 – C

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117/77

C23C 18/16 (2006.01)

Patent

CA 1063445

A B S T R A C T A method of electroless plating together with electroless plating solutions for plating the substrate of a transition metal capable of forming metal peroxides such as molybdenum or tungsten with a layer of metal plate such as chromium, cobalt, nickel or rhodium. The plating process features an oxidation and reduction reaction in which unstable surface oxides on the sub- strate of the transition metal are replaced by the desired metal plate. The method of the invention provides an oxygen impervious plate which protects against oxidation of the metal substrate and eliminates oxide migration as well as providing an improved metal-to-metal plate bond.

233740

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