Electroless plating with nanometer particles

Details Electroless plating with nanometer particles Electroless plating with nanometer particles

B - Operations, Transporting

32

B

B32B 15/04 (2006.01) B05D 1/18 (2006.01) C23C 18/54 (2006.01)

Patent

CA 2575471

The addition of nanometer particles to electroless metal plating baths reduces or eliminates seeding in the electroless plating baths. The reduced seeding results in less inclusions or pitting in the coating. Usually the maintenance and frequent tank-cleaning schedule can be increased beyond the normal 2-3 day. The properties of the coating can be improved by the co-deposition of the particles into the bath. Properties such as hardness, corrosion resistance, and wear resistance were improved.

L~addition de particules nanométriques à des bains de galvanoplastie métallique auto-catalytique réduit ou supprime l~ensemencement dans les bains de galvanoplastie auto-catalytique. Cet ensemencement réduit a pour conséquence une baisse des inclusions ou des piqûres dans le revêtement. Normalement, la maintenance et la fréquence des nettoyages des réservoirs peuvent être portées au-delà des 2 - 3 jours habituels. Les propriétés du revêtement peuvent être améliorées par la co-déposition des particules dans le bain. On a également amélioré des propriétés comme la dureté, la résistance à la corrosion et la résistance à l~usure.

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