C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/48 (2006.01) C23C 18/44 (2006.01) H05K 3/24 (2006.01)
Patent
CA 2415780
The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate: More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders.
Cette invention concerne un dépôt autocatalytique d'un alliage de platine et de rhodium sur un substrat. Elle concerne plus particulièrement un bain galvanoplastique aqueux de platine et de rhodium, un procédé de dépôt d'une couche uniforme d'un alliage de platine et de rhodium sur divers substrats au moyen d'une composition de dépôt autocatalytique, et un article obtenu par dépôt de platine et de rhodium. Ce procédé convient pour le dépôt d'un alliage de platine et de rhodium sur quasiment n'importe quel matériau, quelle que soit sa forme géométrique, y compris les fibres et les poudres.
Kozlov Alexander S.
Narasimhan Dave
Palanisamy Thirumalai
Gowling Lafleur Henderson Llp
Honeywell International Inc.
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