C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/44 (2006.01)
Patent
CA 2415724
This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances thay may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
L'invention concerne l'argenture sans électrodes d'un substrat, un bain d'argenture aqueux, un procédé permettant de déposer un revêtement d'argent uniforme sur différents substrats au moyen d'une composition d'argenture sans électrodes, et un article argenté formé à partir de ladite composition. Le bain d'argenture ne comprend ni ne génère de substances toxiques ou inflammables, ou des substances pouvant contaminer le revêtement d'argent. Lorsqu'on évite les agents de complexage forts, l'argent virtuellement pur peut précipiter à partir du bain par simple ébullition. L'invention concerne également un bain d'argenture autocatalytique sans électrodes constitué de nitrate d'argent, d'hydroxyde d'ammonium, et d'hydrate d'hydrazine.
Kozlov Alexander S.
Narasimhan Dave
Palanisamy Thirumalai
Gowling Lafleur Henderson Llp
Honeywell International Inc.
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