C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 1/04 (2006.01) C25D 3/38 (2006.01)
Patent
CA 2448892
The present invention generally relates to an electrolyte solution used to manufacture an electrolytic copper foil for a secondary battery electrode collector and a printed circuit, and based on a 1-liter electrolyte solution, the present invention contains: 0.5 to 40mg of at least one sulfur compound selected from a disulfur compound, diaklyamino- T oxomethyl- thioalkan sulfonic acid, and thioalkan sulfonic acid salt; 1 to 1000mg of at least more than one kind of an organic compound selected from a group consisting of a poly aklylene glycol-type surfactant and low molecular gelatin; and 0.1 to 80mg of chlorine ion. The electrolytic copper foil in accordance with the present invention has a roughness R2 is less than 2.0µm, if the electrolytic copper foil is in a thin film state, and has the roughness Rz value of the rough surface within a range of 1.0~3.5µm if the surface of the electrolytic copper foil is treated. Since a roughness value of a polished surface is changed according to polishing of a cathode surface, there is no special restriction.
Kim Ki-Jung
Kim Sang-Beom
Lim Seung-Lin
Yang Jeom-Sik
Bereskin & Parr
Iljin Copper Foil Co. Ltd
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